Products

Product Parameter
Parameters Specification
Model DS-Pioneer T
Size of PCB 50x50-400x400(mm)
Thickness of PCB 0.5~4mm
Size of Material 2.5x2.5-110x40(mm)
PCB Warpage Max.1%
Labellins Acouracy 土0.05mm
XY Repeat Accuracy 0.01mm
Speed 1.0-1.2s/pc(Max)
Acceleration 2.0G
Conveyor Height 900+20mm
Labelling Head 2(standard),4(option)
 Voltage 220Volts +/- 10%.Single phase 50/60Hz
Application Scenario
New Energy
New Energy
Automotive Electronics
Automotive Electronics
New Display
New Display
3C Products
3C Products
5G
5G
Product Advanced Options
  • 01
    Solder Paste Monitoring System

    The sensor will detect the diameter of solder paste remained under the front squeegee to remind the opreator to supply paste.

  • 02
    Automatic Supply Solder Paste

    It’s controlled by electricity and also capable for supplying the solder paste at fixed times.

  • 03
    Stencil Aperture Inspection

    Stencil aperture inspection can be programmed to be carried out automatically to detect clogging on stencil opening, eliminate poor printing from the begining.

  • 04
    Automatic Dispensing Unit

    Attached on CCD Camera XY axis, the dispenser provides basic function of glue dotting using syringe type dispensing needle after solder paste printing.

The above scheme is for reference only and can be customized according to the actual production technical requirements. Please leave your message to facilitate the staff to communicate with you and customize your own plan.
+8613828778415
tina@desen-gz.com
Product Consultation