Products

Solder Paste Printing Machine
  • Automatic platform calibration system
  • Integrated molding structure of the entire machine frame
  • Flexible side clamping system
  • Automatic multi-cleaning system for steel mesh
  • Classic second platform calibration
  • Capable for 5G,New Energy,Power Battery and New Display
  • Printing size:80*50mm-2000*510mm
Product Parameter
Parameters Specification
Model DGL-S
Screen Frame Size  737mm x 300mm ~ 2300mm x737mm
Substrate Handling Size (minimum) 80mm (X) x 50mm (Y)
Substrate Handling Size (maximum) 2000mm (X) x510mm (Y)
Cycle Time 12s
Screen Frame Thickness 20mm - 40mm
Substrate Thickness 0.4mm - 6mm
Print Pressure 0kg - 20kg
Print Speed 6mm/s-120mm/s
Print Gap 0mm - 20mm
Substrate Separation  Speed:0.1- 20mm/sec
 Distance:0mm - 30mm
 Apply paste option Solder paste,Printing ink, Silver paste
 Voltage 220Volts +/- 10%.Single phase 50/60Hz
Application Scenario
New Energy
New Energy
Automotive Electronics
Automotive Electronics
New Display
New Display
3C Products
3C Products
5G
5G
Product Advanced Options
  • 01
    Stencil Aperture Inspection

    Stencil aperture inspection can be programmed to be carried out automatically to detect clogging on stencil opening, eliminate poor printing from the begining.

The above scheme is for reference only and can be customized according to the actual production technical requirements. Please leave your message to facilitate the staff to communicate with you and customize your own plan.
+8613828778415
tina@desen-gz.com
Product Consultation